SL2S3003FUDA

IC I-CODE SLI SMART LABEL DIE

Manufacturer: NXP USA Inc. Category: RFID, RF Access, Monitoring ICs Quantity: 1600 RoHS Status: Supported

Basic Information

Part Number:
SL2S3003FUDA
Encapsulation:
-
Package:
Bulk
Description:
IC I-CODE SLI SMART LABEL DIE

Product Parameters

Part Status Active
Mounting Type Surface Mount
Grade -
Qualification -
Voltage - Supply -
Interface -
Frequency 13.56MHz
Package / Case Die
Operating Temperature -40°C ~ 105°C (TJ)
Type RFID Transponder
Supplier Device Package Wafer
Standards ISO 15693, NFC